产品介绍
·陶瓷双列直插式外壳(DIP) ·陶瓷扁平外壳(CFP、CQFP) ·陶瓷针栅阵列外壳(CPGA)
·陶瓷无引线片式载体外壳(LCCC) ·晶体振荡器、声表器件陶瓷外壳 ·各种异型陶瓷元件


陶瓷无引线片式载体外壳(LCCC)
Leadless Ceramic Chip Carries
 
    ·陶瓷无引线片式载体外壳适用于 高密度表面安装。具有体积小、重量 轻、热能好,可靠性高的特点。其管 脚节距有 1.27mm 、1.0mm、0.635mm 等,可带热沉。

    ·LCCC shell fits for high density surface, owns characteristics of small volume, light weight, good thermal quality, high reliability. The pin pitches are1.27/1.0/0.635mm respectively ,with or without heatsink.
C型外壳基本尺寸表
型号 中片芯腔尺寸(D1×E1) 上片内腔尺寸(D2×E2) 外形尺寸(D3×E3) 外形尺寸(D×E) 厚度(h1/h2/h)
C4D3-01 2.2×2.0 3.8×2.0 3.8×2.0 5.6×3.8 0.5/0.5/1.5
C6D3-01 2.4×2.3 4.2×2.3 4.2×2.3 6.2×4.3 0.5/0.5/1.5
C10D3-01 12.2×3.67 12.2×4.86 12.2×4.86 13.3×6.5 0.4/0.4/1.2
C20D32-01 10.67×5.6 10.68×7.62 1067×7.62 13.21×10.16 0.5/0.5/1.5
C28D2-01 15.75×5.6 15.75×7.62 15.75×7.62 18.29×10.16 0.5/0.5/1.5
C32D2-01 18.29×5.6 18.29×7.62 18.29×7.62 20.83×10.16 0.2/0.5/1.5
C12F3-01 9.7×2.9 11.1×4.3 11.1×4.3 13.3×6.5 0.4/0.4/1.5
C18F3-01 4.7×3.6 6.35×5.0 6.35×5.0 8.89×7.24 0.5/0.5/1.5
C28F3-01 9.4×1.32 11.43×6.35 11.43×6.35 13.97×8.89 0.5/0.5/1.5
C32F3-01 9.4×6.86 11.43×8.89 11.43×8.89 13.97×11.43 0.2/0.5/1.5
C24-01 5.7×5.7 7.0×7.0 7.0×7.0 8.5×8.5 0.5/0.5/1.5
C64-01 8.9×8.9 11.2×11.2 11.2×11.2 18.3×18.3 0.5/0.5/1.5
C84-01 11.94×11.94 14.2×14.2 14.2×14.2 29.2×29.2 0.5/0.7/2.2