·陶瓷针栅阵列外壳是VLSI最常用的封
装形式之一。具有封装密度大、电热性能
好、气密性好、可靠性高等特点。常用的
管脚排列节距为 2.54 mm 阵列形式 ，也有
1.27mm交错排列形式，以达到更高的封装
密度。有正腔和反腔、带热沉或不带热沉
等不同结构。
·CPGA packing is one of the normal form for VLSI, which features high package density, good electric thermal property, good air-tightness and high reliability. The usual pin pitch is 2.54mm, also 1.27mm staggered arrangement for higher density. There are different structures such as positive/negative cavity, with/without heatsink. |
 |
