产品介绍
·陶瓷双列直插式外壳(DIP) ·陶瓷扁平外壳(CFP、CQFP) ·陶瓷针栅阵列外壳(CPGA)
·陶瓷无引线片式载体外壳(LCCC) ·晶体振荡器、声表器件陶瓷外壳 ·各种异型陶瓷元件

陶瓷扁平外壳（CFP、CQFP）
Ceramic Flat Package、Ceramic Quad Flat Package
 
 
    ·陶瓷扁平外壳是适合表面安装的封 装形式。具有体积小、重量轻、封装密 度高、安装方便、可靠性高等特点。CFP 的引线节距为 1.27mm，CQFP的引线节 距为1.27mm、1.0mm、0.635mm等，可带 热沉。

    ·The flat ceramic shell is suitable for surface fix, featuring small volume, light weight, high package density, convenience for fixing and good reliability. The pitch between CFP/CQFP lead wires is 1.27mm,and 1.27/1.0/ 0.635mm respectively, and maybe with heatsink.
 
F型外壳基本尺寸表
型号 中片芯腔尺寸(D1×E1) 上片内腔尺寸(D2×E2) 外形尺寸(D3×E3) 外形尺寸(D×E) 厚度(h1/h2/h3) 外引线间距(e)
F03-01 1.9×2.0 2.9×2.9 4.5×4.5 4.5×6.0 0.5/0.5/1.5 1.27
F03-02 6.2×3.2 7.8×4.0 9.6×5.8 9.6×7.0 0.5/0.5/1.5 3.81
F03-04 1.5×2.0 1.5×4.3 3.5×6.3 3.5×7.8 0.5/0.5/1.5 1.27
F04-01 2.7×2.7 4.5×3.5 4.5×5.5 6.5×7.0 0.5/0.5/1.5 1.27
F04-02 1.1×1.1 2.7×2.0 4.5×3.8 4.5×5.0 0.4/0.3/1.1 1.27
F24-01 5.2×5.2 7.2×7.2   10.16×10.16 0.5/0.5/1.5 1.27